Sublimation material compatible ALD system 'TFALD-201'
Detailed customization is possible! Uniform film formation on high aspect ratio three-dimensional structures.
The "TFALD-201" is a research and development ALD system compatible with sublimation materials. It supports the deposition of metal oxides, precious metals, and composite metal films. Additionally, you can select suitable gas supply units according to the pressure of various materials and reaction gases. Furthermore, the material unit and gas supply unit can be added or removed as needed. 【Features】 ■ Compatible with sublimation materials ■ For research and development ■ Supports the deposition of metal oxides, precious metals, and composite metal films ■ Uniform film deposition on high aspect ratio three-dimensional structures ■ Detailed customization is possible *For more details, please refer to the PDF document or feel free to contact us.
- 企業：テクノファイン
- 価格：Other
